By Topic

Thermal optimum analyses and mechanical design of 10-kA, vapor-cooled power leads for SSC superconducting magnet tests at MTL

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

9 Author(s)
Shu, Q.S. ; Superconducting Super Collider Lab., Dallas, TX, USA ; Demko, J. ; Dorman, R. ; Finan, D.
more authors

Spiral-fan, 10-kA, helium vapor-cooled power leads have been designed for Superconducting Super Collider superconducting magnet tests at the Magnet Test Laboratory. To thermally optimize the parameters of the power leads, the lead diameters, which minimize the Carnot work for several different lengths, two different fin geometries, and two RRR values of the lead materials were determined. The cryogenic refrigeration and liquefaction loads for supporting the leads have also been calculated. The optimum operational condition with different currents is discussed. An improved mechanical design of the 10-kA power leads was undertaken, with careful consideration of the cryogenic and mechanical performance. In the design, a new thermal barrier device to reduce heat conduction from the vacuum and gas seal area was used. Therefore, the electric insulation assembly, which isolates the ground potential parts of the lead from the high-power parts, was moved into a warm region to prevent vacuum and helium leakage in the O-ring seals due to transient cold temperature. The instrumentation for testing the power leads is also discussed.<>

Published in:

Applied Superconductivity, IEEE Transactions on  (Volume:3 ,  Issue: 1 )