Cart (Loading....) | Create Account
Close category search window

Effects of deposition conditions on stoichiometry of off-axis RF sputtered BiSrCaCuO thin films

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Yang, Y.F. ; Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA ; Nordman, J.E. ; Lee, J.U.

The composition of as-grown BiSrCaCuO superconducting thin films has been investigated as a function of the RF magnetron sputtering variables, i.e. total sputtering pressure, substrate temperature, and oxygen partial pressure in an off-axis configuration. This study shows that use of off-axis geometry alone is insufficient to completely overcome the resputtering problem due to energetic particle bombardment on the substrate. The bismuth loss in the sputtered films at low sputtering pressure and copper loss at high pressure, both of which were aggravated at increasing temperatures, were observed. The mechanisms of thermally enhanced resputtering and gas scattering effects at high pressure are proposed to interpret the discrepancy between target and film composition.<>

Published in:

Applied Superconductivity, IEEE Transactions on  (Volume:3 ,  Issue: 1 )

Date of Publication:

March 1993

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.