Referenced Items are not available for this document.
The following topics were dealt with: power electronics; thermal management; heat sinks; cooling; packaging; heat losses; heat dissipation; reliability; electrical contacts; semiconductor device models; digital simulation; semiconductor device testing; thermal design; thermal analysis; railways; and electric traction
Published in:
Thermal Management in Power Electronics Systems, IEE Colloquium on
Date of Conference: 22 Mar 1993
- INSPEC Accession Number:
- 4408313
- Conference Location :
- London
- Product Type:
- Conference Publications
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