By Topic

On the edge-thermal resistance (ICs)

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
A. K. Sood ; George Mason Univ., Fairfax, VA, USA

Thermal characteristics of integrated circuits (ICs) have long been a major concern for both manufacturers and users of electronic products. An increase in junction temperature can adversely affect the long-term performance and operating life of an IC. Several variables affect junction temperature. The IC vendor controls some of these; the user and the environment in which the device is operated control others. With the continuing trend toward denser and more complex circuits and a growing number of pins, total power dissipation is increasing. Hence management of thermal characteristics remains a valid concern. Heat transfer processes are reviewed, and various methods available for predicting die temperature are discussed.<>

Published in:

IEEE Micro  (Volume:13 ,  Issue: 4 )