By Topic

The effect of release-etch processing on surface microstructure stiction

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Alley, R.L. ; California Univ., Berkeley, CA, USA ; Cuan, G.J. ; Howe, R.T. ; Komvopoulos, K.

A passive polysilicon microstructure is described which has been used to evaluate the stiction or unwanted adhesion occurring after release etch, rinse and dry processing. The results are interpreted in terms of particle adhesion theory. A residue dissolved in the water and redeposited during drying is responsible for one form of adhesion, by solid bridging. A reaction at silicon surfaces immersed in water is suggested as the source of this residue. Formation of a chemical oxide layer to protect the silicon surfaces alleviates adhesion due to this mechanism. Use of a hydrophobic, low surface energy coating that is applied as part of the rinse process is also described.<>

Published in:

Solid-State Sensor and Actuator Workshop, 1992. 5th Technical Digest., IEEE

Date of Conference:

22-25 June 1992