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Evaluating layout area tradeoffs for high level applications

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2 Author(s)
Kurdahi, F.J. ; Dept. of Electr. & Comput. Eng., California Univ., Irvine, CA, USA ; Ramachandran, C.

The authors address the problem of evaluating area tradeoffs for VLSI layouts from high-level specifications (typically register-transfer level). An area prediction approach based on two models, analytical and constructive, are presented. A circuit design is partitioned recursively down to a level specified by the user, thus generating a slicing tree. An analytical model is then used to predict the shape function of each of the leaf subcircuits. By traversing the tree in post-order, the shape function of the entire layout design can be predicted constructively. This approach also permits the user to trade off the accuracy of the prediction versus the runtime of the predictor. Such a scheme is quite useful for high level design tasks. The authors show experimentally that the estimates obtained using this model are within 5% of the actual layout area for designs ranging from 125 to 12000 cells.<>

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Very Large Scale Integration (VLSI) Systems, IEEE Transactions on  (Volume:1 ,  Issue: 1 )