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Equivalent circuit modeling of interconnects from time-domain measurements

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3 Author(s)
Jyh-Ming Jong ; Dept. of Electr. & Comput. Eng., Oregon State Univ., Corvallis, OR, USA ; Janko, B. ; Tripathi, V.

A technique for the equivalent circuit modeling of single and coupled uniform and nonuniform interconnects, including discontinuities such as bends and junctions in high-speed circuits and packages, is presented. The circuit models are extracted from time-domain reflection and transmission measurement (TDR/T). The SPICE simulated results for the extracted circuit models for typical single and coupled structures are compared with the measured data to validate the accuracy of the circuit models

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Components, Hybrids, and Manufacturing Technology, IEEE Transactions on  (Volume:16 ,  Issue: 1 )