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Browse Journals & Magazines > Components, Hybrids, and Manu ...> Volume:16 Issue:1 Help

A low cost manufacturing process for high density hybrid components based on multilayer polyimide/ceramic structures

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7 Author(s)
Tudanca, M. ; Dept. of Componentes y Tecnologia, Telettra Spain, Madrid, Spain ; Luna, R.G. ; Fraile, A. ; Triana, J.
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The authors describe a multichip module component manufacturing process combining multilayer polyimide and multilayer low-temperature cofired ceramic structures, using the latter as the encapsulation support. A first characterization of the results is also reported

Published in:
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on  (Volume:16 ,  Issue: 1 )

Date of Publication: Feb 1993

Page(s):
13 - 20
ISSN :
0148-6411
INSPEC Accession Number:
4456273
Digital Object Identifier :
10.1109/33.214855
Product Type:
Journals & Magazines
Date of Current Version :
06 August 2002
Issue Date :
Feb 1993
Sponsored by :
IEEE Components, Packaging, and Manufacturing Technology Society

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