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A low cost manufacturing process for high density hybrid components based on multilayer polyimide/ceramic structures

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7 Author(s)
M. Tudanca ; Dept. of Componentes y Tecnologia, Telettra Spain, Madrid, Spain ; R. G. Luna ; A. Fraile ; J. Triana
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The authors describe a multichip module component manufacturing process combining multilayer polyimide and multilayer low-temperature cofired ceramic structures, using the latter as the encapsulation support. A first characterization of the results is also reported

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IEEE Transactions on Components, Hybrids, and Manufacturing Technology  (Volume:16 ,  Issue: 1 )