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The application of laser process technology to thin film packaging

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5 Author(s)
T. F. Redmond ; IBM, Hopewell Junction, NY, USA ; J. R. Lankard ; J. G. Balz ; G. R. Proto
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Laser process technologies have been developed which are well suited to the manufacture of thin-film electronic packages. The authors discuss three technologies-laser ablation, laser-assisted metal etching, and laser chemical vapor deposition-and how they may be used in polymer and metal patterning. The history of the technologies, process and tooling considerations, and specific applications are presented

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IEEE Transactions on Components, Hybrids, and Manufacturing Technology  (Volume:16 ,  Issue: 1 )