Cart (Loading....) | Create Account
Close category search window

A CCD/CMOS-based imager with integrated focal plane signal processing

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Keast, C.L. ; Dept. of Electr. Eng. & Comput. Sci., MIT, Cambridge, MA, USA ; Sodini, C.G.

Using a CCD/CMOS technology, a fully parallel 4×4 focal plane processor, which performs image acquisition, smoothing, and segmentation, has been fabricated and characterized. In this chip, image brightness is converted into signal charge using charge-coupled-device (CCD) imaging techniques. The Gaussian smoothing operation is approximated by the repeated application of a simple nearest-neighbor binomial convolution mask, realizing the first known use of a true two-dimensional charge division and transfer process. The design allows full control of the spatial extent of the smoothing operation, and incorporates segmentation circuits with global variable threshold control at each pixel location to preserve edges in the image. The processed image is read out using a standard CCD clocking scheme

Published in:

Solid-State Circuits, IEEE Journal of  (Volume:28 ,  Issue: 4 )

Date of Publication:

Apr 1993

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.