Referenced Items are not available for this document.
Data are presented characterizing high-performance parallel bonded fine enamelled wires which have been applied to HDD (hard disk drive) heads. This wire {OFC 2P-UEWB(RG)SL} is shown to be superior in mechanical strength, electrical insulation properties, and high-frequency characteristics to the single wire which has been widely used for HDD heads. This parallel wire has the same clean solderability, chemical resistance, and thermal life as single wire. In addition, the parallel wire has excellent automatic windability, and it has better hand-windability than single wire. Special oxygen-free copper-type parallel bonded wire {AOFC 2P-UEWB(RG)SL} is very suitable for finer size wire
Published in:
Electrical Electronics Insulation Conference, 1989. Chicago '89 EEIC/ICWA Exposition., Proceedings of the 19th
Date of Conference: 25-28 Sep 1989
- Page(s):
- 173 - 179
- Meeting Date :
- 25 Sep 1989-28 Sep 1989
- INSPEC Accession Number:
- 3615000
- Conference Location :
- Chicago, IL
- Digital Object Identifier :
- 10.1109/EEIC.1989.208219
- Product Type:
- Conference Publications
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