Cart (Loading....) | Create Account
Close category search window
 

Addressing the challenges of advanced packaging and interconnection

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
Herrell, D.J. ; Microelectron. & Computer Technology Corp., Austin, TX, USA

The author contends that packaging and interconnection technology is undergoing significant changes to meet the rapidly evolving requirements of portable electronics products. The need for high density and high performance at low cost demands sophisticated developments in technology. Future portable equipment packaging requirements can be met only through advanced concepts, including multichip modules, tape-automated bonding, and flip-chip assembly. Supporting technologies, such as adhesive assembly, thermal management, and design tools must also make attendant advances. Consortium-based cooperative research and development of technologies addresses these needs, while also developing the essential vendor infrastructure.<>

Published in:

Micro, IEEE  (Volume:13 ,  Issue: 2 )

Date of Publication:

April 1993

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.