Reliability assessment of high lead count TAB package

The reliability assessment of a high-lead-count tape automated bonding (TAB) package using advanced packaging technology is described. The package was developed to replace existing leaded chip carriers for high I/O and high-performance applications. The package technology uses Au bumps and Au-plated, single-metal two-layer 70-mm Cu tape with a polyimide support ring. After inner lead bonding and chip encapsulation, the chip-on-tape was epoxy attached to a ceramic base and lid. This clamshell design provided both mechanical and environmental protection to the integrated circuit device.<
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