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Reliability assessment of high lead count TAB package

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4 Author(s)
Ling, J. ; Digital Equipment Corp., Hudson, MA, USA ; Teoh, H. ; Sorrells, D. ; Jones, J.

The reliability assessment of a high-lead-count tape automated bonding (TAB) package using advanced packaging technology is described. The package was developed to replace existing leaded chip carriers for high I/O and high-performance applications. The package technology uses Au bumps and Au-plated, single-metal two-layer 70-mm Cu tape with a polyimide support ring. After inner lead bonding and chip encapsulation, the chip-on-tape was epoxy attached to a ceramic base and lid. This clamshell design provided both mechanical and environmental protection to the integrated circuit device

Published in:

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on  (Volume:15 ,  Issue: 6 )

Date of Publication:

Dec 1992

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