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Gold-to-aluminum bonding for TAB applications

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1 Author(s)
Kang, S.K. ; IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA

In thermocompression bonding used in tape automated bonding (TAB) technology, the gold-to-aluminum interface is one of the most difficult bonds that can be formed, because a thin aluminum oxide layer inhibits bonding at low temperatures. The usual bonding temperature is, therefore, expected to be higher than 500°C. This results in extensive growth of intermetallics. In an effort to reduce the bonding temperature of a TAB application, a laser-processed gold-plated balltape was used for thermocompression bonding to aluminum. The effects of hardness, thickness, and morphology of the gold layer on thermocompression bonding have been investigated. As a result, an improved gold layer surface morphology has been developed by controlling the plating rate. The new bumped tape structure was bonded at temperatures from 500°C down to as low as 350°C

Published in:

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on  (Volume:15 ,  Issue: 6 )

Date of Publication:

Dec 1992

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