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A road map to ARPA involvement in electronic packaging

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1 Author(s)
L. A. Glasser ; ARPA, Arlington, VA, USA

The application of advanced electronic packaging and interconnect (EP/I) technology by US Department of Defense's Advance Research Projects Agency are discussed. The EP/I domain includes packages, multichip modules (MCMs), connectors, printed circuit boards (PCBs), boxes, backplanes, and cages. The EP/I physical technologies, including diamond substrates, superconductors, and metal matrix packages, are discussed, and information technologies are described.<>

Published in:

Computer  (Volume:26 ,  Issue: 4 )