Cart (Loading....) | Create Account
Close category search window
 

Design for packageability-early consideration of packaging from a VLSI designer's viewpoint

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Dehkordi, P.H. ; Dept. of Electr. & Comput. Eng., Tennessee Univ., Knoxville, TN, USA ; Bouldin, D.W.

Designing VLSI dies without considering packaging issues may result in a suboptimum system. It is argued that before the design of VLSI dies is completed, packaging issues should be evaluated, since they may affect choices in VLSI circuit design and layout. To illustrate this, the design of an image processing chip-set of three integrated circuits for wire-bond printed circuit board (PCB) and flip-chip multichip module deposited (MCM-D) technologies is reviewed. It is shown that the characteristics of these chips vary, since they are designed with different packaging in mind.<>

Published in:

Computer  (Volume:26 ,  Issue: 4 )

Date of Publication:

April 1993

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.