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Design for packageability-early consideration of packaging from a VLSI designer's viewpoint

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2 Author(s)
P. H. Dehkordi ; Dept. of Electr. & Comput. Eng., Tennessee Univ., Knoxville, TN, USA ; D. W. Bouldin

Designing VLSI dies without considering packaging issues may result in a suboptimum system. It is argued that before the design of VLSI dies is completed, packaging issues should be evaluated, since they may affect choices in VLSI circuit design and layout. To illustrate this, the design of an image processing chip-set of three integrated circuits for wire-bond printed circuit board (PCB) and flip-chip multichip module deposited (MCM-D) technologies is reviewed. It is shown that the characteristics of these chips vary, since they are designed with different packaging in mind.<>

Published in:

Computer  (Volume:26 ,  Issue: 4 )