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Early package analysis: considerations and case study

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3 Author(s)
LaPotin, D.P. ; IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA ; Mazzawy, T.R. ; White, M.L.

Several issues associated with multichip module (MCM) system design are discussed. An early analysis tool for evaluating the tradeoffs between a design and packaging technology is presented. A case study of a possible design point suggested by combining different package elements being used in MCMs settings is included. The case study indicates that the most effective packaging solution for high-performance applications, requiring multichip modules, will likely represent a progression from cofired ceramics (MCM-C) to a thin-film and hybrid cofired ceramic (MCM-D/C) module.<>

Published in:

Computer  (Volume:26 ,  Issue: 4 )