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Overlay high-density interconnect: a chips-first multichip module technology

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3 Author(s)
Daum, Wolfgang ; GE Corporate Res. & Dev. Center, Schenectady, NY, USA ; Burdick, W.E., Jr. ; Fillion, R.A.

A high-density interconnection (HDI) technology that involves placing bare chips into cavities on a base substrate and fabricating the thin-film interconnect structure on top of the components is described. The interconnects to the chip I/O pads are formed as part of the thin-film fabrication process, thus eliminating the need for wire bonds, tape-automated bonds (TABs), or solder bumps. The need for advanced packaging and interconnection and the standard chips-last multichip module (MCM) technologies are reviewed. The HDI chips-first MCM technology's IC pretest requirements and approaches, substrate and packaged parts test, and substrate packaging are discussed.<>

Published in:

Computer  (Volume:26 ,  Issue: 4 )

Date of Publication:

April 1993

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