Referenced Items are not available for this document.
A high-density interconnection (HDI) technology that involves placing bare chips into cavities on a base substrate and fabricating the thin-film interconnect structure on top of the components is described. The interconnects to the chip I/O pads are formed as part of the thin-film fabrication process, thus eliminating the need for wire bonds, tape-automated bonds (TABs), or solder bumps. The need for advanced packaging and interconnection and the standard chips-last multichip module (MCM) technologies are reviewed. The HDI chips-first MCM technology's IC pretest requirements and approaches, substrate and packaged parts test, and substrate packaging are discussed.<
Published in:
Computer
(Volume:26
,
Issue:
4
)
Date of Publication: April 1993
- Page(s):
- 23 - 29
- ISSN :
- 0018-9162
- INSPEC Accession Number:
- 4433666
- Digital Object Identifier :
- 10.1109/2.206510
- Product Type:
- Journals & Magazines
- Date of Current Version :
- 06 August 2002
- Issue Date :
- April 1993
- Sponsored by :
- IEEE Computer Society
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