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Development of a multichip module DSP

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2 Author(s)
Scannell, R.K. ; Rockwell Int., Anaheim, CA, USA ; Hagge, J.K.

The signal processor packaging design (SPPD) general-purpose digital signal processor (DSP) architecture is discussed. SPPD is a highly modular processor architecture that is based on off-the-shelf components and that supports a multichip module (MCM) design implementation that delivers 400 million floating-point operations per second in a 75-g package. The interconnect-substrate design, MCM package assembly, MCM testing, and tradeoffs in size, weight, and cost of the SPPD packaging are described.<>

Published in:

Computer  (Volume:26 ,  Issue: 4 )