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A compact multichannel transceiver module using planar-processed optical waveguides and flip-chip optoelectronic components

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7 Author(s)
Jackson, K.P. ; IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA ; Flint, E.B. ; Cina, M.F. ; Lacey, D.
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A compact, planar-processed package using flip-chip, self-aligned optoelectronic components is described. The packaging concepts are compatible with existing high-speed, high-density electronic materials and processes and therefore have the potential for high-volume, low-cost manufacturing. The concepts are demonstrated using a four-channel transceiver module utilizing planar-processed optical waveguides and flip-chip optoelectronic components. An overview of the package is presented, and the substrate, the optoelectronic chip alignment, the module connector, and link tests are described

Published in:

Electronic Components and Technology Conference, 1992. Proceedings., 42nd

Date of Conference:

18-20 May 1992

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