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An integrated approach for electrical performance analysis of multichip modules

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2 Author(s)
J. C. Liao ; Intel Corp., Chandler, AZ, USA ; G. N. Choksi

The authors describe an integrated approach to evaluate the electrical performance of multichip modules. A software system consisting of modeling and simulation tools to extract geometry from a placement and routing system, compute electrical parasiticsm, and create equivalent circuit files to perform circuit simulations has been developed. This tool was used in designing an i486 microprocessor-based multichip module. Typical results from the analysis are presented

Published in:

Multi-Chip Module Conference, 1992. MCMC-92, Proceedings 1992 IEEE

Date of Conference:

18-20 Mar 1992