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Browse Journals & Magazines > Electron Devices, IEEE Transa ...> Volume:36 Issue:3 Help

E-beam direct wafer writing process using a water-soluble conductive layer

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2 Author(s)
Watanabe, Hisashi ; Matushita Electron. Corp., Kyoto, Japan ; Todokoro, Yoshihiro

The water-soluble conductive layer(WSCL) is ammonium poly (p-styrene sulfonate) having ionic conductivity and water solubility. The process consists of applying thin WSCL to the e-beam resist surface prior to the conventional exposure step. WSCL is subsequently removed and the e-beam resist developed in the ordinary way. The process has general utility for various resists, eliminating charging effects caused by -beam exposure

Published in:
Electron Devices, IEEE Transactions on  (Volume:36 ,  Issue: 3 )

Date of Publication: Mar 1989

Page(s):
474 - 478
ISSN :
0018-9383
INSPEC Accession Number:
3375731
Digital Object Identifier :
10.1109/16.19956
Product Type:
Journals & Magazines
Date of Current Version :
06 August 2002
Issue Date :
Mar 1989
Sponsored by :
IEEE Electron Devices Society

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