By Topic

Thermal management of electronic networks using TLM

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $33
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
S. H. Pulko ; Dept. of Electron. Eng., Hull Univ., UK ; D. de Cogan

The heat transfer processes involved in the thermal management of electronic networks are complex. TLM (transmission line modelling) is an implementationally advantageous method of modelling heat transfer and related phenomena. The authors discuss the possibility and appropriateness of using the TLM technique to model aspects of heat dissipation in electronic networks. The following aspects of thermal effects in electronic networks are considered: modelling of heat transfer by conduction, convection and radiation, the incorporation of nonlinear thermal properties; the treatment of numerically stiff problems; modelling of forced air cooling; and modelling of changes of state

Published in:

Computer Aided Design Tools for Thermal Management, IEE Colloquium on

Date of Conference:

15 Dec 1989