Referenced Items are not available for this document.
Results on a via-hole interconnect that links a coplanar waveguide (CPW) on one side of a 100 mu m-thick GaAs substrate to a microstrip line on the opposite side are presented. The measured insertion loss of a pair of back-to-back connections is 0.3 dB between 26.5 and 40 GHz. A lumped-element equivalent circuit of this via-hole interconnect has been extrapolated to W-band and used to design amplifiers at 94 GHz.<
Published in:
Microwave and Guided Wave Letters, IEEE
(Volume:3
,
Issue:
2
)
Date of Publication: Feb. 1993
- Page(s):
- 29 - 31
- ISSN :
- 1051-8207
- INSPEC Accession Number:
- 4380838
- Digital Object Identifier :
- 10.1109/75.196031
- Product Type:
- Journals & Magazines
- Date of Current Version :
- 06 August 2002
- Issue Date :
- Feb. 1993
- Sponsored by :
- IEEE Microwave Theory and Techniques Society
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