By Topic

Communication network issues and high-density interconnects in large-scale distributed computing systems

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Tewksbury, S.K. ; AT&T Bell Labs., Holmdel, NJ, USA ; Hornak, L.A.

The authors discuss the impact of the physical interconnection environment through which the concurrent processes among locally distinct computing nodes of large-scale multicomputer systems are coupled. The communication capabilities implied for massively parallel computing systems by fine-grain task partitioning and by fine-grained communications are discussed in detail. Wafer-scale and hybrid wafer-scale system technologies which would support such communications are described

Published in:

Selected Areas in Communications, IEEE Journal on  (Volume:6 ,  Issue: 3 )