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Design of multichip modules

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1 Author(s)
Schaper, L.W. ; Alcoa Electron. Packaging., San Diego, CA, USA

The process and pitfalls of multichip module (MCM) design, including the constraints, tradeoffs, figures of merit, and considerations which make MCM design a unique interdisciplinary challenge are discussed. The MCM must provide the proper operating environment for the chips it contains. It must also fit the constraints of the system in which it is contained. It must be manufacturable, testable, and repairable. The many aspects of MCM design are described, starting with system benefits, then system and MCM partitioning, chip environment, system constraints, and infrastructure/manufacturing issues

Published in:

Proceedings of the IEEE  (Volume:80 ,  Issue: 12 )