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Multichip packaging-a tutorial

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1 Author(s)
R. R. Tummala ; IBM Corp., Hopewell Junction, NY, USA

Several aspects of the multichip module technology, including its functions, leverages, applications, and markets, are reviewed. All the packaging technologies used in multichip, such as sealing and encapsulation, heat removal, chip level connections, thin film, ceramic, and printed wiring, are discussed. The module corrections and electrical testing used in forming a high-performance or portable system are also discussed

Published in:

Proceedings of the IEEE  (Volume:80 ,  Issue: 12 )