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Packaging requirements for high volume wireless communications

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3 Author(s)
Green, D.R. ; AT&T Bell Lab., Reading, PA, USA ; Beccone, J.P. ; Crispell, R.B.

Summary form only given. The authors presented an overview of present and anticipated high-volume wireless communication applications, with emphasis on cellular and cordless phones, for MMICs (monolithic microwave integrated circuits) and MICs. The packaging requirements are discussed for existing and emerging standards.<>

Published in:

Microwave Symposium Digest, 1992., IEEE MTT-S International

Date of Conference:

1-5 June 1992