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Thermal compensation of semiconductor strain gauge type pressure transducers using a real-time process

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1 Author(s)
Pyne, C.R. ; R. Aerosp. Establ., Bedford, UK

A method is described in which digital computing techniques are used in conjunction with custom-built hardware to improve the thermal stability of semiconductor strain-gauge-type pressure transducers. The basic design philosophy is discussed. Preliminary laboratory results on a sample of twelve transducers have been very encouraging, providing compensated values (as a temperature coefficient presented as a function of the full-scale pressure range) on the order of ±0.002%FS/°C. On some devices this represents an improvement of approximately two orders of magnitude over the corresponding uncompensated value

Published in:

Instrumentation in Aerospace Simulation Facilities, 1991. ICIASF '91 Record., International Congress on

Date of Conference:

27-31 Oct 1991