Referenced Items are not available for this document.
The thermal performances of multichip modules (MCMs) are compared on the basis of their interconnection technologies. The comparisons are made for hermetic and conduction cooled use environments. The thermal performances of the chip-first-type high density interconnect (HDI) technology, the flipped chip (FCP) technology, and the flipped tape automated bond (FTAB) technology are analyzed and compared for the MCM applications. The results show the thermal performance of each interconnect technology and the most effective ways of improving the performance of MCMs
Published in:
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
(Volume:15
,
Issue:
5
)
Date of Publication: Oct 1992
- Page(s):
- 860 - 869
- ISSN :
- 0148-6411
- INSPEC Accession Number:
- 4360513
- Digital Object Identifier :
- 10.1109/33.180052
- Date of Current Version :
- 06 August 2002
- Issue Date :
- Oct 1992
- Sponsored by :
- IEEE Components, Packaging, and Manufacturing Technology Society
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