Referenced Items are not available for this document.
The evaluation of a compact liquid cooling system is provided as a benchmark of self-contained heat exchanger units that can be used in small movable electronic equipment. The sealed system contains a fluid expansion chamber, a liquid-to-air heat exchanger core, a fan, and a pump that connects to a multichip module (MCM) package through a pair of flexible stainless steel hoses. Temperatures were recorded as a function of pressure, package power dissipation, and flow rate. The 5.5-L system can remove up to 274 W of power with a 52°C temperature drop from inlet liquid to air for a thermal resistance of 0. 19°C/W while pumping perfluorocarbon FC-72 at a flow rate of 1.1 L/min. Design criteria and improvements for a second generation system are proposed
Published in:
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
(Volume:15
,
Issue:
5
)
Date of Publication: Oct 1992
- Page(s):
- 786 - 793
- ISSN :
- 0148-6411
- INSPEC Accession Number:
- 4360506
- Digital Object Identifier :
- 10.1109/33.180044
- Product Type:
- Journals & Magazines
- Date of Current Version :
- 06 August 2002
- Issue Date :
- Oct 1992
- Sponsored by :
- IEEE Components, Packaging, and Manufacturing Technology Society
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