Compact liquid cooling system for small, moveable electronic equipment

The evaluation of a compact liquid cooling system is provided as a benchmark of self-contained heat exchanger units that can be used in small movable electronic equipment. The sealed system contains a fluid expansion chamber, a liquid-to-air heat exchanger core, a fan, and a pump that connects to a multichip module (MCM) package through a pair of flexible stainless steel hoses. Temperatures were recorded as a function of pressure, package power dissipation, and flow rate. The 5.5-L system can remove up to 274 W of power with a 52 degrees C temperature drop from inlet liquid to air for a thermal resistance of 0. 19 degrees C/W while pumping perfluorocarbon FC-72 at a flow rate of 1.1 L/min. Design criteria and improvements for a second generation system are proposed.<
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