By Topic

Extensions of the closed form method for substrate thermal analyzers to include thermal resistances from source-to-substrate and source-to-ambient

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
Ellison, G.N. ; Tektronix Inc., Beaverton, OR, USA

The Fourier series/integral closed-form method for substrate thermal analyzers has been limited by the specification of heat sources on the substrate surface. A method of complementing the basic substrate boundary value problem with lumped thermal resistances is described. In this manner, the thermal interface resistance between a chip package and board, as well as between the same package and a local ambient can be accommodated. The technique consists of combining the methods of Fourier series solution and lumped parameter thermal resistances. The theory is verified by comparing results with both thermal network and finite element model calculations for a sample problem consisting of four active devices attached to a substrate. The ramifications of a uniform heat flux at the board surface are examined by evaluating an approximate representation of a surface mount chip package. Results are compared with experimental test data for a small printed circuit board with 56 dual in-line resistor packs

Published in:

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on  (Volume:15 ,  Issue: 5 )