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Using a thermal simulation model to interpret test data

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2 Author(s)
Azar, K. ; AT&T Bell Lab., North Andover, MA, USA ; Manno, V.P.

The concurrent utilization of testing and simulation models in electronic system thermal characterization is illustrated through three series of tests involving air cooling of circuit boards with regular and irregular component layouts. A simulation model based upon a combination of integral energy and momentum balances and local thermal networks is used in these exercises. Specific sensitivities tested include component powering, component height, and arrangement heterogeneity. The treatment of convective heat transfer and the estimation of coolant flow split among component flow channels were found to be the most important sensitivities in these tests. Special consideration is given to using simulation models to reduce uncertainties in estimating adiabatic heat transfer coefficients. The general process of data interpretation using a simulation model is outlined as a series of guidelines

Published in:

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on  (Volume:15 ,  Issue: 5 )