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Hot topics-trends in advanced packaging technology

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1 Author(s)
Balde, J.W. ; Interconnection Decision Consulting, Flemington, NJ, USA

Advanced packaging is shifting to greater use of multichip modules (MCMs) for applications, not just those running on mainframes. It is argued that the reasons are threefold: higher performance, smaller size, and lower cost.<>

Published in:

Computer  (Volume:25 ,  Issue: 12 )