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A Rh/Au/Rh rigid air-bridge interconnection technique for ultra-high speed GaAs LSIs

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5 Author(s)
T. Inoue ; Toshiba Corp., Kawasaki, Japan ; K. Tomita ; Y. Kitaura ; T. Terada
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A rhodium/gold/rhodium (Rh/Au/Rh) air-bridge interconnection has been developed for applying to ultra-high-speed GaAs LSIs. This structure is suitable for forming a mechanically strong air-bridge interconnection, which enables an interconnection length to be expanded without many support-pillars, compared with a gold air-bridge interconnection. This contribution of the air-bridge interconnection to total propagation delay time in a GaAs LSI chip is quantitively investigated. It is found that applying the air-bridge interconnection to a GaAs LSI with 10 K-gate complexity causes total delay time to be reduced to 65%, compared with the conventional interconnection.<>

Published in:

Gallium Arsenide Integrated Circuit (GaAs IC) Symposium, 1990. Technical Digest 1990., 12th Annual

Date of Conference:

7-10 Oct. 1990