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Narrow channel heat sink for cooling of high powered electronic components

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3 Author(s)
Azar, K. ; AT&T Bell Lab., North Andover, MA, USA ; McLeod, R.S. ; Caron, R.E.

The authors show the results of narrow channel heat sinks used for cooling of high powered components. The results of the experimental simulation for various air delivery methods are reported. The results show the difference in the thermal performance of the heat sink with top clearance versus ducted systems. In addition, effects of component layout power variation and air velocity are shown. A discussion highlighting the optimization of the heat sink in terms of the controlling parameters and fabrication is also presented

Published in:

Semiconductor Thermal Measurement and Management Symposium, 1992. SEMI-THERM VIII., Eighth Annual IEEE

Date of Conference:

3-5 Feb 1992