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Carbon Nanotubes show great potential to be used as an interface material for heat transport in IC cooling due to their high thermal conductivity. In this work, we developed a novel photothermal metrology to characterize the thermal properties of vertically aligned carbon nanotubes array (V-CNTA), which is grown directly on silicon/copper substrate with plasma-enhanced chemical vapor deposition (PECVD). The thermal conductivity of the V-CNTA and the thermal interface contact resistance are measured and correlated with theoretical calculation. The total thermal resistance of V-CNTA is measured to be 0.12 cm2. K/W with a pressure of 60 psi and decreases with increasing the applied pressure. It demonstrated the capability of using V-CNTA for IC cooling. The total thermal resistance of the thermal grease is also measured for comparison.