By Topic

Multifunctional Probe Array and Local Vapor Inking Chip for Scanning Probe Nanolithography

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Shifeng Li ; Micro and Nanotechnology Laboratory, University of Illinois at Urbana and Champaign, 208 North Wright Street, Urbana, IL, USA, 61801, lsfui@uiuc.edu ; Chang Liu ; Xuefeng Wang

We present the design and application of a multifunctional scanning probe array for scanning probe lithography (SPL) applications, along with a new method for chemically inking the probes for nanoscale lithography. Each multi-functional scanning probe chip consists of an array of active probes. The dimensions and materials of the probes within the array are different, giving rise to different functions such as dip pen nanolithography, scanning probe contact printing, and AFM-mode imaging. The microfabricated multi-functional probe simplifies registration of SPL patterns. The novel local inking chip is based on local thermal evaporative inking transfer. The new inking transfer method results in low loss, rapid, and parallel inking action. The scanning probes are accommodated at the opening of each ink reservoir. A resistive heater located at the back of the chip is used to provide local heating to initiate vaporization of inks to uniformly coat individual probe within several minutes. Moreover, this inking chip also has multiple-probe inking capabilities.

Published in:

2006 Sixth IEEE Conference on Nanotechnology  (Volume:2 )

Date of Conference:

17-20 June 2006