Scheduled System Maintenance on May 29th, 2015:
IEEE Xplore will be upgraded between 11:00 AM and 10:00 PM EDT. During this time there may be intermittent impact on performance. We apologize for any inconvenience.
By Topic

An Open-Source Spacecraft Plasma Interaction Simulation Code PicUp3D: Tests and Validations

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

6 Author(s)
Forest, J. ; Artenum Co. ESA/ESTEC/TEG-EES, Noordwijk ; Hilgers, A. ; Thiebault, B. ; Eliasson, L.
more authors

The PicUp3D code is a prototype of simulation software dedicated to quantitative and accurate modeling of spacecraft plasma interactions developed in the context of a European scientific and industrial network Spacecraft Plasma Interaction Network in Europe. It is based on a full three-dimensional kinetic particle-in-cell description of the electrons and the ion dynamics. The use of unstructured schemes in the spacecraft geometrical description has allowed to model successfully realistic geometries. The code is organized around an open and versatile object-oriented library and is fully written in JAVA. This paper presents the basic features and the first validation tests of PicUp3D, which are now made publicly and freely available on the Web. Developed in an open-source approach, it is believed that this code will meet the requirements of the scientific community in terms of geometric and physics accuracy especially for instrument calibration and observation analysis

Published in:

Plasma Science, IEEE Transactions on  (Volume:34 ,  Issue: 5 )