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Copper Direct Drilling With TEA \hbox {CO}_{2} Laser in Manufacture of High-Density Interconnection Printed Circuit Board

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2 Author(s)
Xiang Yi Fang ; Sch. of Sci., Xian Jiaotong Univ., Xian City ; Yung, K.C.

A method for copper direct drilling by carbon dioxide (CO2 ) laser was investigated for efficient microvia formation on the copper conducting layer of high-density interconnection (HDI) of printed circuit board (PCB). A metal-tin layer was coated on the surface of copper conductor foil to enhance the CO2 laser energy adsorption on it. The coated surfaces were then drilled by a CO2 laser with various pulse energies. The microvia holes were efficiently formed in good quality with one laser pulse on 9-mum-thick polished copper conducting layer. The laser energy absorption of coated copper foils was approximately calculated. The experimental results demonstrated the potential application of the developed method in high-density interconnection printed circuit board manufacturing

Published in:

Electronics Packaging Manufacturing, IEEE Transactions on  (Volume:29 ,  Issue: 3 )