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High-Performance Low-Cost 10-Gb/s Coaxial DFB Laser Module Packaging by Conventional TO-Can Materials and Processes

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3 Author(s)
Tien-Tsorng Shih ; Dept. of Electron. Eng., Nat. Kaohsiung Univ. of Appl. Sci. ; Min-Ching Lin ; Wood-Hi Cheng

High-performance low-cost 10-Gb/s coaxial DFB laser module packages made by conventional TO-Can materials and processes are developed and fabricated. The laser module has a built-in matching resistor to reduce the resonant phenomenon. In order to optimize the module's performance, a detailed equivalent circuit model is established to investigate both the DFB laser diode and the coaxial package comprehensively. This uncooled 10-Gb/s laser module operates at a high temperature of up to 105degC, and maintains an eye mask margin above 28% in the full operational temperature range to meet the stringent requirements of 10-Gb/s Ethernet for long-reach applications. This paper demonstrates that it is possible to fabricate cost-effective packages using existing low-cost TO-Can package technology while maintaining the high performance of the 10-Gb/s coaxial laser modules. Previously, the high-performance 10-Gb/s coaxial laser modules have only been available by using complicated design, customized components, and specialized fabrication process

Published in:

Selected Topics in Quantum Electronics, IEEE Journal of  (Volume:12 ,  Issue: 5 )

Date of Publication:

Sept.-Oct. 2006

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