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Balancing SoC Design and Technology Challenges at 45nm

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1 Author(s)
Stork, J.M.C. ; Texas Instruments, Inc., Dallas, TX

The ability of advanced CMOS to integrate processor cores, memory and ASIC logic with RF and analog functions on the same die, has enabled unprecedented density and performance especially for mobile communication systems. Continuing this progress at 45nm and below requires simultaneously improving gate density, system power, and functional performance while reducing the cost per finished die

Published in:

VLSI Technology, 2006. Digest of Technical Papers. 2006 Symposium on

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