By Topic

Use of Electronics in Package Design

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
Goff, J.W. ; School of Packaging, Michigan State University, East Lansing, Mich.

Electronic devices have been used both for the measurement and laboratory simulation of mechanical and atmospheric phenomena which produce damage in packaged merchandise. These uses include: sensors to monitor velocity, acceleration and strain in the packaged part; analog computer to simulate the complete package system; and analysis of package atmosphere with the aid of humidity sensors, gas chromatography and odor detectors.

Published in:

Industrial Electronics and Control Instrumentation, IEEE Transactions on  (Volume:IECI-11 ,  Issue: 1 )