By Topic

Design and test strategy underlying a low-voltage analog-baseband IC for 802.11a/b/g WLAN SiP receivers

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Pui-In Mak ; FST, Macau Univ., Macao, China ; Seng-Pan U ; R. P. Martins

The proliferation of multiple WLANs and the continuous scaling of CMOS have created the need for low-voltage multistandard WLAN receivers. Instead of approaching a complicated SoC, a 3D-stack SiP appears as a promising alternative to meet those requirements in conjunction with the obvious goals of low power and low cost. This paper, focused on the SiP implementation of a WLAN receiver, presents the design and test strategies underlying its analog-baseband portion to accomplish: low-voltage operation; 802.11a/b/g compliance; high routability in 3D stacking; and net-response testability of the functional blocks

Published in:

2006 IEEE International Symposium on Circuits and Systems

Date of Conference:

21-24 May 2006