By Topic

Performance Modeling based on Multidimensional Surface Learning for Performance Predictions of Parallel Applications in Non-Dedicated Environments

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Yagnik, J. ; Google Inc., Mountain View, CA ; Sanjay, H.A. ; Vadhiyar, S.

Modeling the performance behavior of parallel applications to predict the execution times of the applications for larger problem sizes and number of processors has been an active area of research for several years. The existing curve fitting strategies for performance modeling utilize data from experiments that are conducted under uniform loading conditions. Hence the accuracy of these models degrade when the load conditions on the machines and network change. In this paper, we analyze a curve fitting model that attempts to predict execution times for any load conditions that may exist on the systems during application execution. Based on the experiments conducted with the model for a parallel eigenvalue problem, we propose a multi-dimensional curve-fitting model based on rational polynomials for performance predictions of parallel applications in non-dedicated environments. We used the rational polynomial based model to predict execution times for 2 other parallel applications on systems with large load dynamics. In all the cases, the model gave good predictions of execution times with average percentage prediction errors of less than 20%

Published in:

Parallel Processing, 2006. ICPP 2006. International Conference on

Date of Conference:

14-18 Aug. 2006