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PLC-based 1.3/1.49/1.55 μm WDM transceiver with modular structure using chip-scale-packaged OE devices

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11 Author(s)
Nakanishi, Y. ; NTT Photonics Labs., NTT Corp., Atsugi, Japan ; Hirota, H. ; Watanabe, K. ; Hashizume, Y.
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A novel modular structure to improve the fabrication yield and reliability of hybrid-integrated planar lightwave circuit modules is presented. A chip-scale packaging technique for optoelectronic devices has been developed, and a 1.3/1.49/1.55 μm optical WDM transceiver module as a key component has been successfully fabricated.

Published in:

Electronics Letters  (Volume:42 ,  Issue: 15 )

Date of Publication:

20 July 2006

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