Cart (Loading....) | Create Account
Close category search window
 

Using Fuzzy Analytical Hierarchy Process for Multi-criteria Evaluation Model of High-yield Bonds Investment

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)

The returns and risks of high-yield bond (HYB) lie between the stocks and Treasury bonds. In view of investment opportunities and the rate of return, the advantages of HYB are both lower risks and higher shares. Therefore, HYB has become one of important components in the portfolios. The purpose of this study is to find evaluation factors and their weights to aid the selection of HYB. The primary criteria to evaluate HYB are established by the literatures survey with Fuzzy Delphi Method (FDM), and then Fuzzy Analytic Hierarchy Process (FAHP) is employed to calculate the weights of these criteria, so as to build the Fuzzy Multi-criteria model of HYB investments. The results indicate a greatest weight on the dimension of economic environment, and three primary evaluation criteria are: (1) spread versus Treasuries, (2) callability, and (3) default rate.

Published in:

Fuzzy Systems, 2006 IEEE International Conference on

Date of Conference:

0-0 0

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.